Impact de la rugosité sur le refroidissement d'un composant électronique

The thermal management of electronic components is a critical factor in ensuring their reliability, performance, and durability. This study investigates the impact of surface roughness on the cooling efficiency of electronic devices. The research is structured into three primary sections: a general overview of active and passive electronic components, a theoretical analysis of the thermodynamic influences of roughness on various heat transfer modes (conduction, convection, and radiation), and a numerical simulation conducted using Siemens Simcenter FloTHERM XT software. The numerical analysis compares the thermal behavior of a specific electronic component under two conditions: a perfectly smooth surface (0mm roughness) and a surface with a defined roughness of 1mm. The simulation results demonstrate that surface roughness significantly alters heat flux distribution and can lead to a localized reduction in thermal conductivity. These irregularities create increased thermal resistance, causing heat accumulation in specific zones that might otherwise be overlooked. The findings indicate that neglecting surface roughness in thermal modeling can result in an underestimation of internal component temperatures, potentially leading to premature failure or degraded performance. Consequently, this study highlights the necessity of incorporating surface texture parameters into the design and optimization of cooling systems to enhance the thermal management of modern electronic hardware.