E. S. Hsiue, R. L. Miller
The development of a new matrix system, specifically the dicyanate Semi-Interpenetrating Polymer Network (semi-IPN), aims to merge the benefits of thermoplastics and thermosets for high-performance applications. This paper investigates the chemistry and characterization of dicyanate semi-IPNs, demonstrating their potential as suitable candidates for high-temperature, fiber-reinforced composites. The methodology includes the formulation of various composite materials and the assessment of their mechanical and thermal properties. Notable findings indicate that the dicyanate semi-IPN matrix showcases superior performance in comparison to traditional epoxy/Kevlar composites, particularly in applications such as printed circuit boards and aerospace structural components. Enhanced features include lower dielectric constants, improved thermal resistance, and better mechanical properties. The study concludes that dicyanate semi-IPNs exhibit noteworthy impact strength and elongation to break, suggesting their viability for advanced composite applications. These results position the dicyanate semi-IPN as a transformative material in reinforcing engineering standards for future composite developments.
@article{10dba8ca-1b42-454c-8a17-4d09c788a47b,
title={ICCM5 V1 121},
author={E. S. Hsiue and R. L. Miller},
year={2026},
language={en}
}TY - JOUR TI - ICCM5 V1 121 AU - E. S. Hsiue AU - R. L. Miller PY - 2026 LA - en ER -
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