W. E. G. Hansal, M. Halmdienst
In the present work, the electrochemical deposition of pure tin coatings using pulse plating techniques was thoroughly investigated to determine the impact of various pulse plating parameters on the morphology and microhardness of the deposits. The primary objective was to assess whether pulse plating could enhance the surface hardness of pure tin, a material known for its softness. The methodology included experimental comparisons of coatings deposited via direct current and pulsed current, analyzing variables such as duty cycle, frequency, and current density. The results indicated that while direct current produced matt layers with powdery areas, the implementation of pulsed current significantly improved the structural integrity of the deposits, particularly at lower duty cycles (10%). Furthermore, increasing the frequency at higher duty cycles was found to positively influence the hardness of the coating. This study provides insights into optimizing pure tin coatings for applications in packaging and microelectronics, emphasizing the potential of pulse plating techniques to enhance desirable material properties.
@article{18442a11-19ba-4748-97ea-467704a1f2e2,
title={Influence of pulse plating parameters on morphology and hardness of pure tin deposit},
author={W. E. G. Hansal and M. Halmdienst},
year={2008},
language={en}
}TY - JOUR TI - Influence of pulse plating parameters on morphology and hardness of pure tin deposit AU - W. E. G. Hansal AU - M. Halmdienst PY - 2008 LA - en ER -
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