J0310103 CFD simulation of flow solderin

Flow soldering processes have been studied using Computational Fluid Dynamics (CFD) with a focus on the solder filling in narrow openings of masks. The study targets a printed circuit board with both through-hole and surface-mounted components, covered by a mask during soldering. The method involves soldering surface-mounted components first and then dipping the board into a solder bath to solder the through-hole components. This research investigates the solder flow dynamics specifically in the narrow gaps created by the mask openings. Experimental data dictates the determination of parameters such as surface tension and contact angles. Previous studies have highlighted challenges in replicating the desired solder flow characteristics using CFD. The current research aims to use OpenFOAM, an open-source CFD software, to accurately model the solder flow into the mask openings and analyze the influence of contact angles and interfacial tension on the solder's behavior during the flow soldering process. Through comparative analysis with experimental results, we aim to further refine the computational model for improved alignment with actual manufacturing scenarios and enhance understanding of the relationships between mask carrier designs and solder defects.