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Special Issue “Advanced Coating Technology by Physical Vapor Deposition and Applications”

Chuen-Lin Tien

2023encoatingtechnologyvacuumthin filmsdeposition

Abstract

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Coating technology encompasses a broad spectrum of applications across various fields including semiconductors, optoelectronics, microelectronics, machinery, aerospace, and medical biotechnology. This Special Issue aims to introduce advanced coating technologies centered around physical vapor deposition (PVD) methods, which operate under high vacuum conditions to deposit thin films with designated functionalities on substrate surfaces. Several techniques, such as sputtering and evaporation, are discussed, highlighting the advantages of PVD in producing extremely thin and pure coatings while being more environmentally friendly compared to traditional methods. The efficiency of PVD in creating coatings with optimal optical properties and cost-effectiveness is emphasized. In contrast, chemical vapor deposition (CVD) is also overviewed, showcasing its ability to generate high-performance thin films on irregular surfaces but with challenges related to higher temperatures and residual stress in coatings. The continuous improvements in research and development within both academia and industry are vital for enhancing coating quality and reliability. This editorial serves as a gateway to sharing innovative findings and developments within the coating technology community.

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Cite This Work

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  author={Chuen-Lin Tien},
  year={2023},
  language={en}
}
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TI  - Special Issue “Advanced Coating Technology by Physical Vapor Deposition and Applications”
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