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Characterization of Cu-Ag multilayers deposited on brass substrate using electroplating technique

Haider A. Ali, Israa Abdul-Kadir Aziz

2023enelectroplatingmultilayerscoppersilverbrass

Abstract

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In this research, multilayers of Copper (Cu) and Silver (Ag) have been deposited on a brass substrate using an electroplating process (ELP). The first layer of Cu is coated, followed by a layer of Ag, with experiments conducted over five different electroplating periods: 2, 4, 6, 8, and 10 minutes. The parameters, including electroplating time, were studied throughout the experiments. Various measuring methods, including roughness measurement, hardness measurement, and XRD diffraction, were employed to characterize the multilayers relative to all the samples obtained. It was observed that surface roughness, thickness, and hardness increased with a longer electroplating time. The results indicated that extending electroplating time enhances the thickness of the coating layer, while it simultaneously increases the surface roughness of the silver surfaces. The highest micro-hardness values were achieved at the longest coating time (10 min). Furthermore, the results of the X-ray diffraction pattern (XRD) tests confirm the presence of Cu and Ag in both the internal and external layers.

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Cite This Work

@article{1b578351-7833-4363-a911-bad5ae145e42,
  title={Characterization of Cu-Ag multilayers deposited on brass substrate using electroplating technique},
  author={Haider A. Ali and Israa Abdul-Kadir Aziz},
  year={2023},
  language={en}
}
TY  - JOUR
TI  - Characterization of Cu-Ag multilayers deposited on brass substrate using electroplating technique
AU  - Haider A. Ali
AU  - Israa Abdul-Kadir Aziz
PY  - 2023
LA  - en
ER  -

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