Ken England
Elan International, Inc. undertook the task of identifying a suitable Printed Circuit Board (PCB) manufacturer in China capable of producing rigid PCBs that meet stringent specifications for a wire bond application. The objective was to find a manufacturer that could provide an electrolytic gold plating process with ultra-smooth gold surfaces of Ra <20nm, high purity soft gold (99.99%), and compliance with ISO TS16949. To address these requirements, extensive research was conducted, reaching out to over 800 PCB manufacturers. The methodology involved evaluating various companies based on their certifications, capabilities, and understanding of the electrolytic plating process. Results revealed that many companies falsely claimed ISO TS16949 certification or had abandoned electrolytic gold plating for ENIG plating. Additionally, those with electrolytic capabilities often lacked the necessary purity levels or technical expertise to achieve the required ultra-smooth surface. Ultimately, the search highlighted significant challenges in finding manufacturers who could meet all specified criteria while requiring them to adapt to customer needs rather than vice versa.
@article{1eb7de47-a140-4ebe-99d0-12e4ef4145ba,
title={Electrolytic Soft Gold Plating},
author={Ken England},
year={2023},
language={en}
}TY - JOUR TI - Electrolytic Soft Gold Plating AU - Ken England PY - 2023 LA - en ER -
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