D. S. STOYCHEV, I. V. TOMOV
This study investigates the effect of electrolyte composition on the microhardness of bright copper coatings electrodeposited from sulphuric acid electrolytes. It was established that variations in sulphuric acid content and the type of brightening agents significantly influence the decrease in microhardness of the deposited coatings over time. Through systematic quantitative and qualitative investigations carried out in situ, the study determined the changes in microhardness alongside alterations in microdeformations, dislocation defects, crystallite size, and texture of copper coatings. The findings demonstrate a clear correlation between these factors. Moreover, the observed decline in microhardness is attributed to recovery and recrystallization processes occurring at room temperature. It has been established that the physicomechanical properties of metals are closely tied to their crystal structure, particularly concerning the interplay between microhardness and the structural characteristics of galvanic coatings. This work advances the understanding of the aging processes in galvanic copper coatings and asserts the importance of preparation conditions on their properties.
@article{1f43a0b6-0db0-4385-af13-cebbc4bedea5,
title={Recovery and recrystallization of electrodeposited bright copper coatings at room temperature. I. Microhardness in relation to coating structure},
author={D. S. STOYCHEV and I. V. TOMOV},
year={1985},
language={en}
}TY - JOUR TI - Recovery and recrystallization of electrodeposited bright copper coatings at room temperature. I. Microhardness in relation to coating structure AU - D. S. STOYCHEV AU - I. V. TOMOV PY - 1985 LA - en ER -
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