Kohei Mori, Yuta Yamakawa
Cu electrorefining using a low-grade copper anode is essential for energy efficiency in metallurgy. This study investigates the effects of various impurity ions and additives on the passivation behavior of low-grade copper anodes during copper electrolysis in an unagitated sulfate solution. Electrolytic experiments were conducted with varying concentrations of nickel, arsenic, bismuth, tin, antimony, and chloride ions. The findings revealed that the presence of 0.596 mol·dm¹3 Ni²+ significantly accelerated anode passivation, whereas As5+ and Bi3+ ions showed a minor effect. Additionally, while solutions containing thiourea extended the time to passivation slightly, increased thiourea concentration reduced passivation time dramatically. The viscosity coefficient of the solution increased with added Ni²+, impacting the diffusion coefficient of Cu²+ ions. The formation of a solid compound within the anode slime with added arsenic and bismuth also contributed to compactness and passivation phenomena, particularly with Cl⁻ ions above 1.13 mmol·dm¹3. These results underscore the complex role of impurities and additives in electrorefining processes, suggesting significant implications for optimizing copper recycling methods.
@article{2dbb34eb-bbb7-4547-9b8d-3fc56f040c33,
title={Effect of Impurity Ions and Additives in Solution of Copper Electrorefining on the Passivation Behavior of Low-Grade Copper Anode},
author={Kohei Mori and Yuta Yamakawa},
year={2022},
language={en}
}TY - JOUR TI - Effect of Impurity Ions and Additives in Solution of Copper Electrorefining on the Passivation Behavior of Low-Grade Copper Anode AU - Kohei Mori AU - Yuta Yamakawa PY - 2022 LA - en ER -
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