V.D. Stankovic, M. Gojo
Data for the codeposition of some types of inert, semiconductive and conductive particles with copper in the electroplating are presented. It is shown that current density and particle concentration in the plating bath strongly affect the particle content in the composites produced. The nature of the particles also has a great influence on the amount of particles entrapped in composites. The presence of particles in composites changes their characteristics, making them better or worse with respect to tensile strength, hardness or surface texture. The particle distribution in electrodeposited composites is uniform across and over the coating.
@article{2e42199d-5ab2-451f-ad76-e95669e115fd,
title={Electrodeposited composite coatings of copper with inert, semiconductive and conductive particles},
author={V.D. Stankovic and M. Gojo},
year={1996},
language={en}
}TY - JOUR TI - Electrodeposited composite coatings of copper with inert, semiconductive and conductive particles AU - V.D. Stankovic AU - M. Gojo PY - 1996 LA - en ER -
Unknown, Unknown
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