BIJAYALAKSMI PANDA, S.C. DAS
A study on cathodic deposition of copper in acidic aqueous sulfate solution has been carried out using a stainless steel cathode and a graphite anode. The objective was to investigate the individual and combined effects of added sulfurous acid and bivalent aquacobal ion on cathode potential, current efficiency, crystal orientations, and deposit morphology. Methodologically, linear sweep voltammetry was employed to analyze the impact of these additives on copper deposition. Results showed that the maximum decrease in cathode potential was around 50 percent in the presence of approximately 12.25 g/L of sulfuric acid alone, compared to roughly 30 percent with 100 ppm of bivalent cobalt. Additionally, the presence of cobalt did not further reduce cathode potential when combined with sulfuric acid. Current efficiency decreased in a concentration-dependent manner with both additives, and specific changes in preferred crystal orientations were noted via X-ray diffraction. Scanning electron microscopy results indicated improved deposit morphology with combined additives compared to individual electrolytes. The findings contribute to a better understanding of cathodic processes in copper deposition under varied chemical conditions.
@article{3aca18c5-13f0-4cad-9b92-75d49229ade2,
title={Cathodic deposition of copper in the pre},
author={BIJAYALAKSMI PANDA and S.C. DAS},
year={2026},
language={en}
}TY - JOUR TI - Cathodic deposition of copper in the pre AU - BIJAYALAKSMI PANDA AU - S.C. DAS PY - 2026 LA - en ER -
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