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Factors affecting chalcopyrite dissolution in NaCl-CuCl2 solutions

M. Lundström, J. Aromaa

2003enchalcopyritedissolutionleachingcopperhydrometallurgy

Abstract

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In this study we aim to identify the factors affecting the rate of chalcopyrite leaching in the presence of cupric ions, in concentrated chloride solutions. Experiments were carried out near the boiling point of the solution (T = 90 °C) at atmospheric pressure with [NaCl] = 280 g/l and [Cu2+] = 1-40 g/l at pH = 2. Electrochemical methods such as cathodic polarization and cyclic voltammetry were used to investigate the solution reactions, specifically the cathodic reactions of copper complexes. To identify the nature and the rate-controlling steps of the reactions rotating disk electrodes were also used. The environment studied is similar to that of the Outokumpu HydroCopperTM process. HydroCopperTM is a novel process for leaching copper from chalcopyrite using cupric chloride solution. The dissolution rate of chalcopyrite depends on the formation of a reaction product layer on the mineral surface. Also thermodynamic and/or kinetic factors of cathodic reactions can affect the nature of the leaching. The results from this study suggest that in the typical redox-potential range of an HydroCopperTM type environment, the dissolved copper exists mainly as the complex [CuCl]+. The diffusion coefficient and the unit rate constants for the solution species were calculated. Also the exchange current density and rate constant for electron transfer was estimated. A simulation was made of the cathodic polarization curve and compared with the experimental results. The cathodic reaction rate did not appear to limit the rate of chalcopyrite dissolution in concentrated cupric chloride environment.

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Cite This Work

@article{46b08854-b835-4854-9a81-af10b50dd37f,
  title={Factors affecting chalcopyrite dissolution in NaCl-CuCl2 solutions},
  author={M. Lundström and J. Aromaa},
  year={2003},
  language={en}
}
TY  - JOUR
TI  - Factors affecting chalcopyrite dissolution in NaCl-CuCl2 solutions
AU  - M. Lundström
AU  - J. Aromaa
PY  - 2003
LA  - en
ER  -

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