The Effect of Organic Surface-Active Additives Upon the Kinetics of Electrodeposition of Ultrafine Copper Powder

This study investigates the influence of organic surface-active additives on the kinetics of electrodeposition of copper ions on polycrystalline copper electrodes from mixed aqueous-organic solutions, aiming to produce ultrafine copper powders. Specifically, we explored the potential of using polyvinyl alcohol and a cationic amine containing polyelectrolyte to obtain copper via electrolysis in a water-isopropanol solution of cupric nitrate. Our findings demonstrate that the application of organic surfactants can significantly reduce the particle size of copper powder, while enhancing the homogeneity concerning fractional composition. The research addresses a gap in the understanding of electrocrystallization parameters relevant to the formation conditions of ultrafine copper powders, particularly in the presence of surfactants, which affect the electrochemical behavior of copper ions. Utilizing potentiodynamic voltammetry, microscopic studies with a scanning electron microscope, and other electrochemical techniques, we analyzed the effects of these additives on the electrochemical processes involved in copper electrodeposition. The results indicate that the surfactants influence nucleation rates and electrocrystallization dynamics, thus altering the properties of the resultant metal powders.