Elena Mariani, Walter Giurlani
Today industrial electroplating is mainly conducted using direct current, yet utilizing modulated currents presents significant advantages. This study investigates how the parameters of deposition affect characteristics such as grain size, porosity, and homogeneity of copper deposits. Using a commercial acid copper bath for pulsed and reverse pulse electroplating, we measured deposition yield, homogeneity, hardness, and reflectivity of the coatings produced. Our experiments reveal that pulsed current plating yields shinier, brighter films compared to those formed under stationary currents, with improved deposition efficiency. Conversely, pulsed-reverse currents promote more uniform deposits across the entire deposition area and mitigate edge effect disturbances. Overall, our findings underscore the effectiveness of modulated current techniques for enhancing the electroplating process in both decorative and functional applications.
@article{4e9c235e-761e-4237-a866-8ca74b18af5d,
title={A systematic study of pulse and pulse reverse plating on acid copper bath for decorative and functional applications},
author={Elena Mariani and Walter Giurlani},
year={2022},
language={en}
}TY - JOUR TI - A systematic study of pulse and pulse reverse plating on acid copper bath for decorative and functional applications AU - Elena Mariani AU - Walter Giurlani PY - 2022 LA - en ER -
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