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A systematic study of pulse and pulse reverse plating on acid copper bath for decorative and functional applications

Elena Mariani, Walter Giurlani

2022enelectroplatingcopperpulse platingfunctional applicationsdecorative applications

Abstract

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Today industrial electroplating is mainly conducted using direct current, yet utilizing modulated currents presents significant advantages. This study investigates how the parameters of deposition affect characteristics such as grain size, porosity, and homogeneity of copper deposits. Using a commercial acid copper bath for pulsed and reverse pulse electroplating, we measured deposition yield, homogeneity, hardness, and reflectivity of the coatings produced. Our experiments reveal that pulsed current plating yields shinier, brighter films compared to those formed under stationary currents, with improved deposition efficiency. Conversely, pulsed-reverse currents promote more uniform deposits across the entire deposition area and mitigate edge effect disturbances. Overall, our findings underscore the effectiveness of modulated current techniques for enhancing the electroplating process in both decorative and functional applications.

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Cite This Work

@article{4e9c235e-761e-4237-a866-8ca74b18af5d,
  title={A systematic study of pulse and pulse reverse plating on acid copper bath for decorative and functional applications},
  author={Elena Mariani and Walter Giurlani},
  year={2022},
  language={en}
}
TY  - JOUR
TI  - A systematic study of pulse and pulse reverse plating on acid copper bath for decorative and functional applications
AU  - Elena Mariani
AU  - Walter Giurlani
PY  - 2022
LA  - en
ER  -

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