Ching An Huang, Jo Hsuan Chang
Cu electrodeposition was performed on a rotating cylindrical Ti electrode in Cu-sulphate plating baths with different thiourea contents up to 8 ppm. The hardness, microstructure and electropolishing behaviour of the Cu deposits were studied. Some sulphur-rich particles in the Cu deposits prepared from the thiourea-containing baths were identified. The sulphur-rich particles dissolved preferentially during electropolishing in a 40 vol.% H3PO4 solution, forming a thin amorphous phase containing P in patches on the outer surface of the Cu deposit. The deposits prepared in the baths with thiourea showed higher dissolution current during polishing and formed a brightened and levelled surface with a surface roughness (Ra) lower than 30 nm.
@article{4edc65be-e852-4dac-8f1a-c801f40b5848,
title={Electropolishing behaviour and microstructures of copper deposits electroplated in an acidic copper-sulphuric bath with different thiourea contents},
author={Ching An Huang and Jo Hsuan Chang},
year={2014},
language={en}
}TY - JOUR TI - Electropolishing behaviour and microstructures of copper deposits electroplated in an acidic copper-sulphuric bath with different thiourea contents AU - Ching An Huang AU - Jo Hsuan Chang PY - 2014 LA - en ER -
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