Pei Yi CHEW, Ah Heng YOU
This study focuses on the preparation of pure copper (Cu) lead frames using powder metallurgy techniques to analyze their electrical and mechanical properties. The Cu samples, with a diameter of 17.7 mm and a height between 10 to 15 mm, were compacted under a consistent pressure of 280 MPa. Sintering was accomplished at two distinct temperatures, 600 °C and 950 °C, over varying durations of 3, 4, and 7 hours. Prior to sintering, the compacted Cu pellets were examined using scanning electron microscopy (SEM) to assess compactness and grain structure. Following the sintering process, the sintered density of the pellets was calculated, and their porosity was evaluated to understand the packing of particles within the sample. SEM and energy-dispersive X-ray spectroscopy (EDX) were utilized to examine porosity and particle agglomeration. To determine the electrical conductivity of the sintered Cu pellets, measurements were compared against standard commercial Cu lead frames used in the industry. Results demonstrate that the fabricated pure Cu lead frames possess substantial electrical properties suitable for application in semiconductor industries.
@article{4ee23561-130c-45f5-a80d-6d2d72d7373f,
title={Preparation of Copper Lead Frame by Powd},
author={Pei Yi CHEW and Ah Heng YOU},
year={2026},
language={en}
}TY - JOUR TI - Preparation of Copper Lead Frame by Powd AU - Pei Yi CHEW AU - Ah Heng YOU PY - 2026 LA - en ER -
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