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Study on the influence of various factors in the hydrometallurgical processing of waste printed circuit boards for copper and gold recovery

Ionela Birloaga, Ida De Michelis, Francesco Ferella, Mihai Buzatu, Francesco Vegliò

2013enPrinted circuit boards Oxidative leaching Thiourea Gold Copperelectronic wasteprinted circuit boardshydrometallurgymetal recoverygold leachingcopper extractioncopper recoverygold recoveryleachinggold extractioncopper leachingcoppergold

Abstract

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This study investigates the hydrometallurgical recovery of copper and gold from waste printed circuit boards (WPCBs) using a sequential oxidative leaching and thiourea leaching process. The primary objective is to optimize copper removal to enhance subsequent gold dissolution, thereby contributing to the development of a less toxic and more sustainable alternative to cyanidation for precious metal recovery from electronic waste. An initial oxidative leaching pre-treatment employing sulfuric acid and hydrogen peroxide was evaluated through a 2³ full factorial design and analysis of variance (ANOVA), with sulfuric acid concentration, hydrogen peroxide volume, and temperature as factors. Under optimized conditions (2 M H₂SO₄, 20 mL 30% H₂O₂, 30 °C, 3 h), copper extraction yields of 76.12% and 18.29% were achieved for two PCB samples, and a second leaching increased copper dissolution to 90% for the more favourable sample. Reduced particle size (<2 mm) and double oxidative leaching enabled 75% copper removal. Subsequent gold extraction was carried out using thiourea (20 g/L) with ferric ions as oxidant (6 g/L Fe³⁺) in acidic medium (10 g/L H₂SO₄, pH ≈ 1.4) at 600 rpm. Tests on waste CPUs and manually removed CPU pins showed that, after adequate copper removal, a gold extraction yield of 69% was obtained, demonstrating the effectiveness of the combined process and clarifying the influence of operating variables on metal recovery efficiencies.

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Cite This Work

@article{57f78e7f-5141-47e7-a64a-43dec7eaa3fe,
  title={Study on the influence of various factors in the hydrometallurgical processing of waste printed circuit boards for copper and gold recovery},
  author={Ionela Birloaga and Ida De Michelis and Francesco Ferella and Mihai Buzatu and Francesco Vegliò},
  year={2013},
  language={en}
}
TY  - JOUR
TI  - Study on the influence of various factors in the hydrometallurgical processing of waste printed circuit boards for copper and gold recovery
AU  - Ionela Birloaga
AU  - Ida De Michelis
AU  - Francesco Ferella
AU  - Mihai Buzatu
AU  - Francesco Vegliò
PY  - 2013
LA  - en
ER  -

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