Ammonium thiosulfate leaching of gold from printed circuit board waste

Hydrometallurgical recovery of metals from printed circuit board waste typically involves multiple leaching stages; conventionally, base metals dissolution by mineral acids is followed by leaching of gold using cyanide or halide based lixiviants. Alternative lixiviants for gold leaching can reduce the potential hazardous nature of operation. The aim of this study was to investigate the feasibility of using thiosulfate as lixiviant for gold leaching from waste printed circuit boards. Batch leaching tests were performed to investigate the effects of thiosulfate concentration (0.1 – 0.2 M), ammonium concentration (0.2 – 0.4 M), pH (9 – 10.5), solids content (25 – 50 g/L), and copper content of the feed material on the gold leaching behavior. The concentrations of metals in liquid samples were determined by means of inductively coupled plasma atomic emission spectroscopy, and high pressure liquid chromatography was used to evaluate thiosulfate degradation/consumption. The ratio of thiosulfate to ammonia was found to have the most significant effect on the extent of gold leaching, with the best gold extraction observed at a ratio of 0.5 mole thiosulfate per mole ammonia. The lower pH range of 9 – 9.5 generally produced better Au leaching, while low copper extraction during the first stage base metal leaching stages has proven to be detrimental to gold leaching from the residue. Thiosulfate degradation/consumption increased and gold extraction decreased with higher residual copper in the feed. An optimum gold extraction of 78.5% from base metal leach residue was achieved with 0.2 M thiosulfate, 0.4 M ammonia, and 0.02 M cupric ions at 25°C in the pH range 9 – 9.5.