G. STREMSDOERFER, F. GHANEM
The present paper describes a new direct chemical plating method of copper, called Dynamic Chemical Plating. This low-cost technology is based on spraying separate aqueous solutions containing copper metallic ions and borohydride reducing agent, enabling copper plating at a rate of 30 µm/h at room temperature. The method shows potential for industrial applications, particularly for metallizing polymers and non-conductors. The investigation focused on the dynamic parameters of copper plating, along with substrate characteristics pertinent to metallization. Key factors such as the wettability of plastic surfaces and the use of a coupling agent as an undercoat layer were identified as critical for initiating plating and enhancing the adhesion of copper to substrates. Additionally, pre-treatment conditions like corona discharge, plating kinetics, and the electrical properties of the resultant copper film were thoroughly examined. The findings suggest that while traditional electroless plating techniques have their advantages, they also encounter numerous challenges which Dynamic Chemical Plating seeks to address.
@article{644d4590-ab73-4a73-90a0-53b668b6560b,
title={Copper deposition by Dynamic Chemical Plating},
author={G. STREMSDOERFER and F. GHANEM},
year={2003},
language={en}
}TY - JOUR TI - Copper deposition by Dynamic Chemical Plating AU - G. STREMSDOERFER AU - F. GHANEM PY - 2003 LA - en ER -
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