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Growth of electrodeposited copper on ano

J.-L. DELPLANCKE, M. ONGARO

2026encopperelectrodepositiontitaniumelectrochemistrymetal growth

Abstract

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Copper electrocrystallization at high current density was studied in a pure copper sulphate–sulphuric acid bath. The objective was to emphasize the influence of the current density, electrolyte flow rate, and titanium substrate pretreatment on the nucleation and growth of copper. Methodologically, the study involved analysis of 100 μm thick copper deposits using techniques such as Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM), and X-ray diffraction to detail the structure and properties of the deposits. Results indicated that the deposits exhibit two distinct layers; the layer in contact with the substrate consists of a high density of very small crystals and corresponds to the unioriented dispersion (UD) type, while the layer facing the electrolyte is predominantly controlled by electrodeposition parameters leading to a field oriented (FT)–UD type. The thickness of the transition zone between these two layers was found to depend on the anodic oxidation conditions of the substrate pretreatment. Additionally, some copper foils were observed to recrystallize at room temperature.

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Cite This Work

@article{69f3470e-315e-498f-a777-64cbbd3315ea,
  title={Growth of electrodeposited copper on ano},
  author={J.-L. DELPLANCKE and M. ONGARO},
  year={2026},
  language={en}
}
TY  - JOUR
TI  - Growth of electrodeposited copper on ano
AU  - J.-L. DELPLANCKE
AU  - M. ONGARO
PY  - 2026
LA  - en
ER  -

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