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Characterization of Nano/Micro Size Copper Powder Bi-Product of Electropolishing process

A.M. Awad, Aref M. E. Abd-El – Rahman

2010enelectropolishingcoppernanoparticlesmaterials sciencesurface treatmentultra fine coppersurface levelingroughnesssmoothness

Abstract

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This study investigates the production of ultra fine copper particles as a by-product from the electropolishing process, which involves anodic oxidation of copper in an electrolytic cell containing 55% phosphoric acid. The experiment utilized a direct current power supply linking copper as the anode and lead as the cathode, which facilitated anodic dissolution of copper ions that were subsequently neutralized and deposited at the cathode surface. Various techniques including scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX) were employed to characterize the size and morphology of the resulting copper particles. The findings reveal insights into the efficiency of the electropolishing method in generating copper with enhanced surface quality, alongside the mechanical advantages of the produced ultra fine particles, marking significant implications for applications in materials science and electronics. These results underscore the relevance of electropolishing as a viable technique for improving the properties of copper-based materials. Consequently, the research contributes to the ongoing exploration of nano and micro-sized conductive materials.

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Cite This Work

@article{72252dc0-99c9-45fe-a74e-536df1a986c4,
  title={Characterization of Nano/Micro Size Copper Powder Bi-Product of Electropolishing process},
  author={A.M. Awad and Aref M. E. Abd-El – Rahman},
  year={2010},
  language={en}
}
TY  - JOUR
TI  - Characterization of Nano/Micro Size Copper Powder Bi-Product of Electropolishing process
AU  - A.M. Awad
AU  - Aref M. E. Abd-El – Rahman
PY  - 2010
LA  - en
ER  -

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