A. Balasubramanian, D. S. Srikumar
This study investigates the pulsed electrodeposition of copper on stainless steel in a copper sulfate bath, focusing on the effects of duty cycle and frequency on thickness and current efficiencies at both 50°C and room temperature with an average current density of 4 A dm². A novel strike bath based on cupric chloride and hydrochloric acid was developed for the first time. Cu coatings were analyzed by Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM), and X-ray Diffraction (XRD), allowing for the calculation of crystallite sizes using Scherer’s equation across various duty cycles. The findings revealed that the resulting deposits exhibited smaller nodules and finer grains, contributing to better mechanical properties and reduced porosity in the coatings. Overall, the results highlight the significance of pulse parameters in optimizing the electrodeposition process, potentially leading to advancements in surface engineering applications for improved corrosion resistance and deposit quality.
@article{8e758c3f-0cef-48b6-88a7-1cccddbeed79,
title={Effect of pulse parameter on pulsed electrodeposition of copper on stainless steel},
author={A. Balasubramanian and D. S. Srikumar},
year={2009},
language={en}
}TY - JOUR TI - Effect of pulse parameter on pulsed electrodeposition of copper on stainless steel AU - A. Balasubramanian AU - D. S. Srikumar PY - 2009 LA - en ER -
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