S. Mohan, V. Raj
The pulsed electrodeposition of copper from a copper sulfate bath has been systematically investigated to understand the effects of various parameters on the resultant deposits. This study aimed to analyze the influence of pulse duty cycles ranging from 5–80%, frequencies ranging from 10 to 100 Hz, and current densities from 2.5 to 7.5 A/dm² on properties such as thickness, hardness, current efficiency, and throwing power of the electrodeposits. Additionally, the effects of two specific additives, polyethylene glycol and di-sodium EDTA, on the characteristics of the copper deposits were examined. The results indicate that pulsed current parameters significantly affect the mechanical and chemical qualities of the deposits, enabling the production of harder, fine-grained, and pore-free copper deposits. This research contributes valuable insights into the optimization of pulsed plating processes and the role that organic additives play in refining the properties of electrodeposits, addressing a gap in existing literature on this topic. The study's outcomes are expected to enhance the understanding of pulsed electrodeposition and its applications in the metallurgical field.
@article{924c247b-6bae-4ba9-b551-e96fe93400fb,
title={The effect of additives on the pulsed electrodeposition of copper},
author={S. Mohan and V. Raj},
year={1998},
language={en}
}TY - JOUR TI - The effect of additives on the pulsed electrodeposition of copper AU - S. Mohan AU - V. Raj PY - 1998 LA - en ER -
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