FUNDAMENTALS STUDIES OF ｅｌｅｃｔｒｏｾｓｉｌｖｅｒ PLATING PROCESS

The growth of the electronic industry and the demand to support the expansion of its underlying infrastructure drive improvements in the electroplating process. This study focuses on the fundamental aspects of silver electroplating, which is crucial for the semiconductor industry, particularly in lead frame manufacturing. A series of experiments were conducted using a cyanide-based plating bath to deposit silver on copper electrodes while varying parameters such as bath concentration of potassium argentum cyanide and current density to assess their effects on current efficiency and uniformity of electrodeposition. The concentration of potassium argentum cyanide was systematically varied between 66.87 g/l to 100 g/l, alongside a range of current densities from 0.04 A to 0.20 A. Results revealed that optimal plating conditions—considering appropriate bath concentration and current density—are essential for enhancing uniformity in the electrodeposition process. The findings are expected to contribute significantly to optimizing electroplating practices in the electronic industry, with proposed optimum conditions provided at the conclusion of the study.