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Pulse plating of nickel: influence of electrochemical parameters and composition of electrolyte

M. Halmdienst, W. E. G. Hansal

2007enpulse platingnickelhardnessorganic additives

Abstract

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In this paper, the influence of electrochemical parameters and the composition of the electrolyte on the properties of nickel deposits in pulse plating is discussed. The objective was to investigate how organic additives affect the characteristics and electrochemical behavior of a nickel sulphamate bath, derived from fundamental electrochemical experiments. The methodology involved conducting plating experiments using pulsed current to deposit nickel and analyzing the resulting layer properties. The results indicated that the addition of organic bath additives significantly influences the properties of the deposited nickel layers. Notably, while organic additives can enhance the hardness of the layers, they may also interfere with the freshly deposited nickel surface during the off-time of the pulse sequence. The findings demonstrate that optimizing pulse parameters and incorporating organic hardeners into the electrolyte can yield optimal results for thickness and hardness in nickel coatings, suggesting that pulse plating with sulphamate electrolytes offers a promising avenue for improving nickel deposits used in various industrial applications.

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Cite This Work

@article{b5d23636-bced-44ac-81c0-8b6d7c8d05d7,
  title={Pulse plating of nickel: influence of electrochemical parameters and composition of electrolyte},
  author={M. Halmdienst and W. E. G. Hansal},
  year={2007},
  language={en}
}
TY  - JOUR
TI  - Pulse plating of nickel: influence of electrochemical parameters and composition of electrolyte
AU  - M. Halmdienst
AU  - W. E. G. Hansal
PY  - 2007
LA  - en
ER  -

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