Pulse Electrodeposition of Copper-Zinc Coatings from an Alkaline Bath

This study investigates the pulse electrodeposition of copper-zinc coatings from an alkaline bath containing ethylenediaminetetraacetic acid (EDTA) as a complexing agent. The objective is to enhance the mechanical properties of the coatings, specifically focusing on microhardness and wear resistance. Pulse current electrodeposition is employed, with copper substrates serving as the base for deposition. Characterization techniques including scanning electron microscopy (SEM) and X-ray diffraction (XRD) are utilized to analyze the morphology and structure of the deposited films, while energy dispersive spectroscopy (EDS) and EDS-dot mapping provide information on the distribution of Cu-Zn atoms in the coatings. Results indicate that the use of EDTA not only improves the stability of the deposition bath but also significantly affects the quality of the coatings produced. The current density observed during the deposition process was found to be a critical factor influencing the characteristics of the copper-zinc coatings, leading to the conclusion that pulse electrodeposition can yield coatings with superior properties compared to traditional direct current methods. The findings contribute to the understanding of non-cyanide electrodeposition techniques and their applicability in producing high-performance coatings.