Masoud Delgosha, Samira Salehi
The influence of plating mode and chloride ion on the morphology of copper deposits has been studied on pure copper substrates. The electroplating was conducted at 50°C, 25°C in a cupric sulfate-sulfuric acid bath with various chloride additions ranging from 0.001 to 0.01 ml. The morphology and grain sizes of the electrodeposited copper were examined using atomic force microscopy (AFM). The results indicated that the maximum surface roughness and grain sizes of the copper deposit were achieved when deposited with 0.01 ml of chloride ions. Small particles were observed on the surface of the copper film electroplated with the addition of chloride ions at a lower concentration of 0.001 ml.
@article{c3982eaf-82f7-4f39-8976-8d7d44b9bff9,
title={AFM studies of the effect of chloride ion on the morphology of the copper electroplating surface},
author={Masoud Delgosha and Samira Salehi},
year={2014},
language={en}
}TY - JOUR TI - AFM studies of the effect of chloride ion on the morphology of the copper electroplating surface AU - Masoud Delgosha AU - Samira Salehi PY - 2014 LA - en ER -
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