Kazuya Koyama, Mikiya Tanaka
A novel energy-saving hydrometallurgical recovery process for copper from electronic scrap employing the Cu(II)-ammine complex has been presented based on thermodynamic consideration. To experimentally explore the feasibility of the leaching stage in this process, the copper leaching behavior from a printed circuit board (PCB) in ammoniacal alkaline solutions has been investigated under a nitrogen atmosphere. Copper in PCB was oxidized by Cu(II) to form Cu(II)-ammine complex ions. The leaching reaction can be expressed as: Cu + Cu(NH3)2 2+ = 2 Cu(NH3)2+. The Cu(II)-ammine complex significantly enhanced the leaching rate, while slight depression was observed in the leaching rate due to the Cu(I)-ammine complex. Crushing of the PCB effectively enhanced the leaching rate, as it increased the exposed metallic copper area. The effect of temperature on the leaching rate was found to be insignificant. Consequently, the feasibility of the leaching stage in the proposed copper recovery process has been experimentally confirmed.
@article{cccb3a0d-70e2-415d-9f6b-b55ee57a4c74,
title={Copper Leaching Behavior from Waste Prin},
author={Kazuya Koyama and Mikiya Tanaka},
year={2026},
language={en}
}TY - JOUR TI - Copper Leaching Behavior from Waste Prin AU - Kazuya Koyama AU - Mikiya Tanaka PY - 2026 LA - en ER -
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