A Practical Method for Removing Hydrogen Peroxide from Wastewater Generated During Chemical and Mechanical Planarization of Integrated Circuits

The goal of this research was to identify and investigate a practical method for removing hydrogen peroxide from wastewater generated during chemical and mechanical planarization of integrated circuits. Several methods for hydrogen peroxide destruction were evaluated, including ultraviolet (UV) light, electrochemical reduction and oxidation, two activated carbon catalysts, and a pyrolusite catalyst. The influence of ethylenediaminetetraacetic acid (EDTA), ethylenediamine (ED), and dissolved copper ions on hydrogen peroxide destruction rates was also assessed. The findings revealed that UV light and electrochemical methods exhibited insufficient rates for practical applications. Conversely, activated carbon and pyrolusite catalysts demonstrated rapid hydrogen peroxide destruction. Notably, the presence of EDTA and ED reduced the effectiveness of activated carbon yet had no significant impact on pyrolusite. Column experiments with the pyrolusite catalyst achieved greater than 99.9% hydrogen peroxide destruction with short empty bed contact times of just one minute. This research supports the need for effective wastewater treatment solutions in semiconductor manufacturing, particularly for hydrogen peroxide disposal.