Production of Copper Powder from Printed Circuit Boards by Electrodeposition

The accumulation of waste electrical and electronic equipment (WEEE) has gained significant attention due to its potential as a source for metal recovery. The objective of this study was to evaluate the recovery of copper from printed circuit boards (PCBs) through an electrodeposition method. A systematic methodology involved thermal treatment of PCBs at 500°C in both air and nitrogen atmospheres, followed by dissolution in three acid media: HNO3, HCl, and H2SO4, to extract copper. Results indicated that the copper recovery percentages were 97.5% for HNO3, 65% for HCl, and 76.5% for H2SO4. The electrodeposition technique, characterized by high current density, enabled more than 98% copper recovery, yielding copper powder with an 80 µm mean diameter. This process demonstrated a high current efficiency and produced copper suitable for powder metallurgy applications. Overall, the findings underscored the feasibility of utilizing WEEE, particularly PCBs, as a valuable source for copper recovery, highlighting the importance of efficient recycling methods in managing electronic waste.