Anton Salomon, Tilo Bu ¨ ttner
Nickel and nickel alloy foams serve as excellent substrates for energy and chemical technology applications. The objective of this research is to explore methods for enhancing the surface area and modifying the structure of nickel foams to optimize their performance based on various applications. The study utilizes powder metallurgical deposition techniques, specifically the Scattering Technique and Wet Powder Spraying, to achieve desired foam strut morphologies and surface structures. The results indicate that these two methods yield distinct effects on the physical properties of the foams, leading to specific enhancements suitable for applications in electrolysis, wastewater treatment, and general catalysis. Moreover, the formation of Raney-Nickel is highlighted as a key outcome, illustrating the creation of inter-metallic phases that improve the surface properties of the foams. A thorough discussion on the process chain involving surface treatment, alloying, and heat treatment is provided, emphasizing its significance for the stability of alloyed foams across different application domains. The findings contribute valuable insights into the surface modification of nickel foams, thus expanding their potential industrial applications.
@article{daf59ed6-6b9d-49a0-81e8-d3bf2197ccbe,
title={04 Nickel Foam Surface Modification},
author={Anton Salomon and Tilo Bu ¨ ttner},
year={2026},
language={en}
}TY - JOUR TI - 04 Nickel Foam Surface Modification AU - Anton Salomon AU - Tilo Bu ¨ ttner PY - 2026 LA - en ER -
Unknown
This document provides a comprehensive overview of sintering as a fundamental process for consolidating powders into solid bodies without complete mel
This paper addresses the challenge of assessing the feasibility of wind power plant projects at sites with insufficient or no local historic wind data
Important advances in electrochemical engineering technology over the last three decades have fostered the development of a lternative methods to alle
Increasing volumes of waste printed circuit boards from obsolete electronic equipment posed escalating environmental risks and resource losses due to