PDF

Artificial Intelligence Approach for Waste-Printed Circuit Board Recycling: A Systematic Review

Muhammad Mohsin, Stefano Rovetta

2025Englishartificial intelligencedeep learningelectronic wastecircuit boardsrecyclingcomputer vision

Abstract

Language:

The rapid advancement of technology has led to a substantial increase in Waste Electrical and Electronic Equipment (WEEE), which poses significant environmental threats and increases pressure on the planet’s limited natural resources. In response, Artificial Intelligence (AI) has emerged as a key enabler of the Circular Economy (CE), particularly in improving the speed and precision of waste sorting through machine learning and computer vision techniques. Despite this progress, to our knowledge, no comprehensive, systematic review has focused specifically on the role of AI in disassembling and recycling Waste-Printed Circuit Boards (WPCBs). This paper addresses this gap by systematically reviewing recent advancements in AI-driven disassembly and sorting approaches with a focus on machine learning and vision-based methodologies. The review is structured around three areas: (1) the availability and use of datasets for AI-based WPCB recycling; (2) state-of-the-art techniques for selective disassembly and component recognition to enable fast WPCB recycling; and (3) key challenges and possible solutions aimed at enhancing the recovery of critical raw materials (CRMs) from WPCBs.

Download

Cite This Work

@article{e1198986-8acb-43ae-8547-17bb7aa146fc,
  title={Artificial Intelligence Approach for Waste-Printed Circuit Board Recycling: A Systematic Review},
  author={Muhammad Mohsin and Stefano Rovetta},
  year={2025},
  language={English}
}
TY  - JOUR
TI  - Artificial Intelligence Approach for Waste-Printed Circuit Board Recycling: A Systematic Review
AU  - Muhammad Mohsin
AU  - Stefano Rovetta
PY  - 2025
LA  - English
ER  -

Similar Items

Recycling of Printed Circuit Boards to Recover Critical Materials

Md Kaviul Islam, Anirudha Karati

The printed circuit board (PCB), a central component of most electronic devices, represents a significant fraction of the electronic product waste str

2026EnglishPDF

An Objective Metallographic Analysis Approach Based on Advanced Image Processing Techniques

Xabier Sarrionandia, Javier Nieves

Metallographic analyses of nodular iron casting methods are based on visual comparisons according to measuring standards. Specifically, the microstruc

2023EnglishPDF

A Detail-Preserving Multi-Scale Cascaded Network for Infrared Rotary Kiln Shell Temperature Recognition and Refractory Lining Assessment

Jie Li, Jianxin He

Rotary kiln shell temperature monitoring is essential for metallic shell protection and refractory lining maintenance in high-temperature industrial p

2026EnglishPDF

Chapter 20 Electronic Waste

Jirang Cui, Hans Jørgen Roven

Rapid growth in electronic equipment consumption has generated large quantities of electronic waste containing hazardous substances and high-value met

2026enPDF

Recycling of Printed Circuit Boards

2026enPDF

Utilization of Life Cycle Assessment met

2026enPDF