A.K. Mishra, X. Zhang
The effect of copper on the localized corrosion of nickel-chromium-molybdenum (Ni-Cr-Mo) alloys was investigated in hot saline solutions through a comparative analysis of the behavior of N06059 and N06200 alloys. Electrochemical and surface analytical techniques were employed to assess anodic film growth kinetics and passive film properties, revealing no significant influence of copper on these parameters. Both alloys exhibited similar breakdown and repassivation potentials. Advanced spectroscopic methods, including angle-resolved x-ray photoelectron spectroscopy and time-of-flight secondary ion mass spectroscopy, indicated the mobility of copper to the oxide/solution interface during anodic film development, a phenomenon amplified by decreasing pH levels akin to conditions found in a crevice prior to corrosion initiation. Galvanostatically controlled experiments showed that this surface assembly of copper suppressed the metastable breakdown events that typically precede corrosion initiation in the Cu-free alloy. Additionally, dynamic secondary ion mass spectrometry results confirmed copper accumulation alongside molybdates in areas subjected to crevice corrosion, albeit without definitive evidence of copper's direct role in crevice propagation. This study enhances the understanding of copper's interaction in the corrosion mechanisms of Ni-Cr-Mo alloys.
@article{e5df4021-62cb-4ae6-8d12-47efad21affa,
title={The Role of Copper on the Crevice Corrosion Behavior of Nickel-Chromium-Molybdenum Alloys in Aggressive Solutions},
author={A.K. Mishra and X. Zhang},
year={2016},
language={en}
}TY - JOUR TI - The Role of Copper on the Crevice Corrosion Behavior of Nickel-Chromium-Molybdenum Alloys in Aggressive Solutions AU - A.K. Mishra AU - X. Zhang PY - 2016 LA - en ER -
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