Brenner, Riddell
Electroless nickel plating, a process that does not require electrical current or anodes, relies on autocatalytic deposition from an aqueous solution containing metal ions, a reducing agent, and stabilizers. This unique method permits uniform coating of internal surfaces of various parts, a feat challenging for traditional electroplating. Although electroless nickel (EN) plating emerged in the 1940s, its commercial development spans less than 30 years, with significant growth observed over the past decade across diverse applications, from underground installations to outer space. This guide aims to enhance understanding of the electroless nickel plating process by detailing deposit properties, necessary equipment, applicable processes, and testing procedures crucial for achieving and maintaining high-quality deposits. The chemical interactions involving sodium hypophosphite as a reducing agent are outlined, showcasing the auto-catalytic nature of the process. Furthermore, corrosion test methods, including immersion weight loss and electrochemical procedures, are discussed in accordance with ASTM standards. The solderability of electroless nickel-phosphorus deposits is evaluated through heating and practical solder tests. Overall, the guide encapsulates essential knowledge and protocols for the effective application of electroless nickel plating, offering insights for both practitioners and researchers.
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title={WHAT IS ELECTROLESS NICKEL?},
author={Brenner and Riddell},
year={1940},
language={en}
}TY - JOUR TI - WHAT IS ELECTROLESS NICKEL? AU - Brenner AU - Riddell PY - 1940 LA - en ER -
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