Syamsuir, Rizky Septian Kusumah
This study investigates the barreling electroplating of copper (Cu) on aluminum (Al) alloy substrates, focusing on the effects of different rotating speeds on the physical and electrochemical properties of the deposited Cu layers. The main objective is to assess how varying the barrel speed influences parameters such as deposition rate, current efficiency, layer thickness, and corrosion behavior. The methodology includes a systematic electroplating process in a copper sulfate solution, followed by characterizing the Cu layers using scanning electron microscopy, energy dispersive spectroscopy, and X-ray diffraction techniques. Results indicate that increasing the barrel rotation speed reduces the deposition rate, cathodic current efficiency, thickness, roughness, and crystallite size of the Cu layer. Specifically, the sample without rotation exhibited the highest values for deposition rate (32.49 µm h−1), current efficiency (92.08%), and average layer thickness (74.32 µm). In contrast, with a barrel speed of 50 rpm, the Cu layer demonstrated improved morphology, enhanced open circuit potential, and a reduced corrosion rate, highlighting the significance of rotating speed on electroplating performance.
@article{e985b579-352e-46e6-9b0d-c1157dcd3169,
title={Spinning Effect of Barreling Plating on Physical Properties and Electrochemical Behavior of Copper Layers},
author={Syamsuir and Rizky Septian Kusumah},
year={2024},
language={en}
}TY - JOUR TI - Spinning Effect of Barreling Plating on Physical Properties and Electrochemical Behavior of Copper Layers AU - Syamsuir AU - Rizky Septian Kusumah PY - 2024 LA - en ER -
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