2017 Feng Direct Liquid Evaporation CVD Metallization Thesis

With the rapid advancement of the semiconductor industry, fabrications of complex microelectronic devices are going beyond the conventional planar geometries into three-dimensionality (3D). This dissertation addresses the pressing need to innovate in order to accommodate flexible and wearable consumer electronics, thus transforming rigid electronic devices into their flexible counterparts. The objective is to provide fundamental frameworks for 3D electronics and flexible electronics by developing strategies for creating complex structures at nano-/micro-scales, including interconnect architectures. Challenges in fabricating nano-scale high-aspect-ratio metal interconnects, such as the need for high precision, uniformity, and conformality, are examined. The research presents promising solutions through the direct-liquid-evaporation chemical vapor deposition (DLE-CVD) technique, which has been developed in recent years. DLE-CVD effectively delivers a high-throughput precursor with precision into deposition chambers while minimizing decomposition and contamination risks. The dissertation details how DLE-CVD's controlled precursor delivery system outperforms conventional CVD systems, leading to enhanced film conformality and reproducibility. This research contributes to the evolution of microelectronics, supporting the transition towards more advanced and flexible technologies.