Kanchan Mondala, Shashi B. Lalvania
In this study, pulse plating techniques were employed to deposit Cu-Pt alloys from a pyrophosphate bath containing chloroplatinic acid to enhance the mechanical properties of copper. The objectives included investigating the electrochemical behavior of the deposition process and characterizing the resulting deposits. Cyclic voltammetry was utilized to explore the two-step reduction processes of copper and platinum, ultimately leading to bulk electrodeposition under various current densities (2.5 to 7.5 A dm−2). The findings demonstrated that deposits were glossy and crack-free at lower current densities, and the platinum content in the deposits increased with the current applied during both forward pulse and pulse reverse techniques. Characterization revealed that Knoop hardness improved with increased platinum content, exhibiting a maximum increase of 55.4% compared to standard copper samples. Furthermore, corrosion resistance in NaCl solutions showed substantial enhancements, with the forward pulse method achieving a maximum increase of 45.4%. Overall, this research effectively highlights the potential of pulse plating in improving the mechanical and corrosion-resistant properties of copper through platinum incorporation.
@article{f16cf7a2-9ea0-4207-8f2e-b73fd5ee6fb1,
title={Copper-Platinum Deposition by Pulse Plating},
author={Kanchan Mondala and Shashi B. Lalvania},
year={2006},
language={en}
}TY - JOUR TI - Copper-Platinum Deposition by Pulse Plating AU - Kanchan Mondala AU - Shashi B. Lalvania PY - 2006 LA - en ER -
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