Soo-kyung Kim, Jae-chun Lee
The dissolution of tin from waste Pb-free solder was electrochemically investigated in NaOH solution. The objective was to examine the effect of oxygen and hydroxide ion concentration on the leaching behavior of tin. Cyclic voltammetry tests were conducted in varying concentrations of NaOH at temperatures below and at 75°C. Results indicated that two oxidation peaks were observed at lower temperatures, correlating with the oxidation of tin to Sn2+ and subsequently to Sn4+, while only a single peak was noted at 75°C due to direct oxidation to Sn4+. Enhancements in the dissolution of tin were observed with increasing NaOH concentration up to 0.5 kmol m¹3 and the introduction of oxygen, whereas further increases in NaOH concentration and the presence of oxygen reduced tin dissolution rates. The research concluded that the optimal conditions for the alkaline electrolysis of waste solder are above 75°C and around 0.5 kmol m¹3 NaOH, providing insights into effective recycling processes for lead-free solder materials.
@article{f1b7d5e0-a45e-4b67-9d38-5dd21a85cca0,
title={The Effect of Oxygen and Hydroxide Ion on Electrochemical Leaching Behavior of Tin},
author={Soo-kyung Kim and Jae-chun Lee},
year={2012},
language={en}
}TY - JOUR TI - The Effect of Oxygen and Hydroxide Ion on Electrochemical Leaching Behavior of Tin AU - Soo-kyung Kim AU - Jae-chun Lee PY - 2012 LA - en ER -
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