Suhyeon Lee, In-Hyeok Choi
To produce high-purity nickel sulfate from nickel-bearing sludge generated in electroplating processes, this study evaluated a three-step hydrometallurgical pretreatment and purification process comprising sulfuric acid leaching, cementation, and neutralization–precipitation. In the leaching step, the application of 1–2 M H2SO4 at a 25 w/v% solids content achieved near-quantitative dissolution (≥ 99%) of Ni, Cu, and Cr within 15 min, with a low leaching efficiency of 0.5 M. Filtration performance improved markedly at a 1.2 M acid concentration. Complete metal dissolution was confirmed at 10–25 w/v% solids contents, and at ≥ 50 w/v%, slurry viscosity increased, leading to reduced agitation efficiency and suppressed leaching. To remove Cu from the leachate, reducing agents (metallic Fe, FeO, and FeSO4·7H2O) were applied, which facilitated effective separation. Overall, this research provides a comprehensive approach for selectively recovering valuable metals from electroplating sludge using efficient hydrometallurgical processes.
@article{f5dbeb69-427e-47a3-a5e8-408690f5013a,
title={2026 Lee Recovery from Electroplating Sludge},
author={Suhyeon Lee and In-Hyeok Choi},
year={2026},
language={en}
}TY - JOUR TI - 2026 Lee Recovery from Electroplating Sludge AU - Suhyeon Lee AU - In-Hyeok Choi PY - 2026 LA - en ER -
Printed circuit boards (PCBs) from electronic gadgets at the end of their useful life period are currently being dumped in landfills or incinerated, c
The leachability tests for manufacturing scrap TV boards (STVB) have indicated the release of metals beyond the limit levels with potential problems f
ROPAFADZO JAMAKANGA
Printed circuit boards (PCBs) from electronic gadgets at the end of their useful life period are currently being dumped in landfills or incinerated, c
Ionela Birloaga, Ida De Michelis, Francesco Ferella, Mihai Buzatu, Francesco Vegliò
This study investigates the hydrometallurgical recovery of copper and gold from waste printed circuit boards (WPCBs) using a sequential oxidative leac