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2019 Chen Coating Substrate Adhesion Testing Review

Xiaomei Chen, Christopher Shaw

2026encoating adhesionbond strengthnondestructive testingthin filmssurface engineeringmicroscopy

Abstract

Language:

In this paper, recent advances in the minimum-destructive testing of the adhesion of coating-substrate systems are reviewed, focusing on key techniques such as micro- and nano-scale levels of indentation, scratching, laser-induced wave shock, as well as the blister and buckle approach. Along with adhesion failure tests, the latest and most extensive applications of the adhesion test methods in nano-, micro- and bulk-coating technology are discussed, highlighting their significance in improving bond strengths and enhancing the performance of coating systems. This comprehensive overview not only addresses the theoretical underpinnings of these methods but also emphasizes their practical implications in various industrial applications where the reliability and durability of coatings are paramount. The findings suggest that the integration of advanced testing techniques can provide better insights into the interface characteristics, ultimately contributing to the development of more effective coating-substrate combinations.

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Cite This Work

@article{f9956959-40c5-4b78-b3c6-769b88206dc7,
  title={2019 Chen Coating Substrate Adhesion Testing Review},
  author={Xiaomei Chen and Christopher Shaw},
  year={2026},
  language={en}
}
TY  - JOUR
TI  - 2019 Chen Coating Substrate Adhesion Testing Review
AU  - Xiaomei Chen
AU  - Christopher Shaw
PY  - 2026
LA  - en
ER  -

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