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FEM Simulation of Nodulation in Copper Electro-refining

Ken Adachi, Yuya Nakai

2018encopperelectro-refiningnodulationfemsimulationFEM

Abstract

Language:

In the copper electro-refining process, short circuiting between the cathode and anode caused by nodulation has the largest impact on the loss of current efficiency. In order to improve current efficiency, it is critically important to study the mechanism of the growth of the nodule. In this study, nodulation was modeled using the finite element method to simulate the growth of copper bumps attached to the cathode. By considering the scale of the electrodes and their pitch, the relationship between the height of the nodule and its growth rate is investigated. In particular, a threshold height of the nodule that determines whether the nodule will rapidly grow to come in contact with the adjacent anode is identified. By comparing the results of the simulation with experiments, the effect of leveling additives and the generation of dendritic growth are discussed.

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Cite This Work

@article{fc43199e-5062-4466-a3fa-dd23a52a92a6,
  title={FEM Simulation of Nodulation in Copper Electro-refining},
  author={Ken Adachi and Yuya Nakai},
  year={2018},
  language={en}
}
TY  - JOUR
TI  - FEM Simulation of Nodulation in Copper Electro-refining
AU  - Ken Adachi
AU  - Yuya Nakai
PY  - 2018
LA  - en
ER  -

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